The Fast-3D chip coplanarity detection system is specifically designed to provide precise 3D scanning and detection technology for various production and process stages in the semiconductor manufacturing process. The system can achieve the ability to detect the appearance, parameters, and defects of semiconductor products, provide accurate and stable high-quality analysis, comprehensive measurement data, and multi-dimensional image reports to ensure continuous high-quality product output.

The Fast-3D chip coplanarity detection system utilizes industry-leading high-precision intelligent 3D laser imaging technology, which enables high-speed linear scanning while generating 3D morphology and measurement data. The system has sub micron scanning accuracy and can be applied to most materials including multi-layer, transparent/semi transparent, curved edges, high reflectivity, high contrast, textured, and mixed surfaces.

Scope of Application

1. Coplanarity, flatness, position, height, and ball diameter testing of BGA and other ball grid array packaged devices.

2. Pin position, offset, and height detection of chips and integrated circuits after packaging.

3. Wire bonding testing in semiconductor or micro assembled products.

4. Silver paste thickness and bubble defect detection in chip bonding process.

5. Pin detection of connectors.

6. Quality inspection of solder joints on circuit boards and measurement of dimensions and defect detection after packaging.

7. Defect detection of SiC and GaN substrates.

Application scenarios

BGA/CSP/CGGA coplanarity positional detection

BGA/CSP/CCGA devices are common packaged chips with ball grid arrays and column arrays. All solder balls and solder columns are evenly distributed at the bottom of the chip. With the miniaturization of chips and the decreasing diameter of solder ball applications, especially in computing chips where the number of solder balls is increasing, the requirements for the process and quality of SMT soldering in the later stage are also increasing. Therefore, the measurement of coplanarity is particularly important after chip ball implantation, and this system can perform three-dimensional dimensional measurement and defect detection for devices packaged in BGA/CSP/CGA, etc.

PGA height position detection

The full name of PGA is "Pin Grid Array", which is packaged in the form of a pin grid array. The metal pins of the CPU in the PGA package are directly inserted into the holes on the motherboard, and the connection is achieved through the contact between the pins and the holes. The Fast-3D semiconductor quality inspection system can accurately detect the height and positional accuracy of PGA pins, ensuring that there will be no poor contact during subsequent insertion and removal processes, and avoiding defects such as pin damage caused by positional deviation.

Defect detection in wire bonding process

Wire bonding, also known as pressure welding, usually connects wires through ultrasonic pressure welding. This system can measure the height and positional accuracy of wires with high precision, and can also determine whether there are defects such as wire breakage and bending.

Chip size measurement and defect detection

Bare chips or chips loaded into tube shells can quickly scan and obtain the length, width, and height information of the chip. They can also output high-resolution 2D and 3D grayscale images to detect defects such as pits and scratches.

Silver paste thickness and bubble defect detection in chip bonding process

Conductive silver paste is commonly used for bonding in semiconductor chip solidification processes. This system can accurately measure the proportion of silver paste coated area and the height (i.e. thickness) of silver paste in each region. It can generate basic 3D shape data for precise volume measurement of rubber paths and shape based defect detection (such as bubbles and thickness defects).

Connector Pin Detection

In the aerospace, automotive, and other precision electronics industries, the application of connectors is often involved. Electrical failures or faults often occur in connectors due to the different high and low positions of pins. This system can accurately measure the height, consistency, and coplanarity of pins, including the parameters and status of each pin.

Pin detection of integrated circuits

In the SMT production process, integrated circuits such as QPF packaged devices often suffer from soldering defects due to pin floating, poor position and consistency. This system uses intelligent algorithms to measure and detect pins, such as coplanarity, positional accuracy, offset and other key items and parameters.

Microelectronics module shell inspection

In microelectronics manufacturing, modules and tube shells are widely used, and tube shells often have poor sealing effects due to poor flatness. This system can measure the overall height of tube shells, automatically test, judge, and output reports to ensure quality testing before and after production.

Measurement of semiconductor substrate height

Measurement of semiconductor substrate height

In micro assembled products, a large number of semiconductor substrates are used for solidification and eutectic processes, so the high consistency of the substrate is also one of the control data for the product process. This equipment can quickly measure the substrate on the module to ensure the consistency of the substrate's height and coplanarity during the production process.